Micro-Precision Technologies will exhibit at the 2026 IEEE MTT-S
Salem, NH – May 4, 2026 – Micro-Precision Technologies will exhibit at the 2026 IEEE MTT-S International Microwave Symposium (IMS2026), June 9–11 in Boston. Visit Micro-Precision Technologies at Booth 15106.
IMS brings together RF and microwave professionals from around the world to explore emerging technologies, products and technical developments. The event combines a comprehensive technical program with a major industry exhibition featuring manufacturers and technology providers serving the RF and microwave community.
At Booth 15106, attendees can meet with the Micro-Precision Technologies team and learn more about our precision manufacturing capabilities for demanding RF, microwave and related applications.
About MPT
Micro-Precision Technologies, Inc. is a MIL-PRF-38534 manufacturer of hybrid integrated circuits, multichip modules, custom semiconductors, and high-quality metallized thick film ceramic substrates. Additional micro-electronics assembly services include turnkey PCB assembly services, die attach/wire bonding, MEMS assembly, and custom semiconductor packaging.
MPT’s thick film capabilities feature multi-layer conductors, ultra-fine line/spacing down to 5 mils (0.005"), and via holes that can be filled or plated for electrical connections. The company operates clean areas rated Class 100 for precap and Class 10,000 for assembly.
The Company's website is https://www.micropt.com. To discuss new product opportunities, MPT can be reached at +1 603-893-7600 or via email at [email protected].
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- Micro-Precision Technologies, Inc. acquired by Aerospace Semiconductor, Inc.
- Micro-Precision Technologies named the 2019 Jeffrey Butland Family Owned Business of the Year!
- Hybrid Technology on Ceramic Substrates
- Why use ceramic substrates for microelectronics?
Certifications
MPT is MIL-PRF-38534 Class H qualified since 1998, QML-38534 listed, certified by DSCC (Defense Supply Center, Columbus, OH). MPT is AS9100D ISO 9001:2015, and ITAR registered.