Inherent Thermal Management

Ceramic substrates such as alumina, aluminum nitride, and beryllium oxide are highly thermally conductive materials which transfer heat away from hot spots quickly and efficiently, dissipating it over the whole surface. PCB material (FR-4) is epoxy based with poor thermal conductivity, leading to hot spots which reduce the life of most semiconductor junctions. Typical thermal conductivities of ceramics and FR-4 are:

Material (W/m-K)
Alumina 28–35
Aluminum Nitride 140–180
Beryllium Oxide 170–280
FR-4 0.8–1.1

ESS Robustness

Hybrids are microelectronic circuits comprising multiple devices, often in die form, within a hermetically sealed metal enclosure or an impervious conformal coating. All components are insulated and isolated to a high level, giving constituent parts protection from moisture ingress. Hybrid substrates have their conductive tracking and insulating layers fired at 850°C for a peak period of 10 mins., with conductive adhesive device terminations being cured at 150°C for two hours. By comparison, FR-4 PCB assemblies face a maximum temperature of approximately 80–260°C for short periods, beyond which damage to the PCB structure starts to occur.

Higher Temperature Operation

Hybrids utilize components which are capable of long term operation up to 250°C. MPT is building on its experience with hybrid technology in designing and fabricating hybrids for high-temperature operation.

Active Resistor Trimming

Resistor values can be adjusted by laser trimming during the functional operation of the circuit, allowing the dynamic tuning of circuits as an automated production process.

Maintain Electrical Characteristics in Conversion

Single-board computer assembly on MPT ceramic engineered substrate (left) and FR-4 (right). All electrical characteristics and specifications are maintained.

Single-board computer assembly on MPT ceramic engineered substrate and FR-4
Single-board computer assembly on MPT ceramic engineered substrate and FR-4

Why Micro Precision Technologies

  • Small Lot Friendly
  • Consigned or Full Turnkey Assemblies
  • Class 5000 Cleanroom for Assembly (0.5 micron per cubic foot)
  • Class 100 Cleanroom for Pre-Cap Inspection (0.5 micron per cubic foot)
  • ISO-9001:2015 Certified
  • MIL-PRF-38534 Class H Qualified
  • QML-38534 Listed

Contact Us to talk to an engineer about your hybrid assembly today.