Hybrid assembly consists of attaching components onto a screened substrate and sealing the substrate into a package. The hybrid assembly process may include surface mount, die attachment, wire bonding, and packaging.
MPT is committed to excellent quality, customer service, product and process innovation. MPT provides quick turn-around for prototypes and in-time production. MPT has clean areas of Class 100 for pre-cap inspection and class 10,000 for assembly.
Applications
MPT hybrids have been used in:
- Signal Conditioning Systems
- Communications Equipment
- Radar Equipment
- Positioning Systems
- Avionics
- Navigation Systems
- Data Conversion
- Computer Systems
- Frequency Agile Systems
- & More
Why Micro-Precision Technologies
- Small Lot Friendly
- New Product Introduction (NPI)
- Consigned or Full Turnkey Assemblies
- Class 10,000 Cleanroom for Assembly (0.5 micron per cubic foot)
- Class 100 Cleanroom for Pre-Cap Inspection (0.5 micron per cubic foot)
- AS9100D ISO-9001:2015 Certified
- MIL-PRF-38534 Class H Qualified
- QML-38534 Listed
Download Documents (PDFs)
Capabilities Brochure
Talk To Our Engineers
- P: 603-893-7600
- E: [email protected]
- Below is our Quick Contact form. To send us a file, use our Quote form instead.
Certifications
MPT is MIL-PRF-38534 Class H qualified since 1998, QML-38534 listed, certified by DSCC (Defense Supply Center, Columbus, OH). MPT is AS9100D ISO 9001:2015, and ITAR registered.