Hybrid assembly consists of attaching components onto a screened substrate and sealing the substrate into a package. The hybrid assembly process may include surface mount, die attachment, wire bonding, and packaging.

MPT is committed to excellent quality, customer service, product and process innovation. MPT provides quick turn-around for prototypes and in-time production. MPT has clean areas of Class 100 for pre-cap inspection and class 10,000 for assembly.

Applications

MPT hybrids have been used in:

  • Signal Conditioning Systems
  • Communications Equipment
  • Radar Equipment
  • Positioning Systems
  • Avionics
  • Navigation Systems
  • Data Conversion
  • Computer Systems
  • Frequency Agile Systems
  • & More

Why Micro-Precision Technologies

  • Small Lot Friendly
  • New Product Introduction (NPI)
  • Consigned or Full Turnkey Assemblies
  • Class 10,000 Cleanroom for Assembly (0.5 micron per cubic foot)
  • Class 100 Cleanroom for Pre-Cap Inspection (0.5 micron per cubic foot)
  • AS9100D ISO-9001:2015 Certified
  • MIL-PRF-38534 Class H Qualified
  • QML-38534 Listed

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Capabilities Brochure

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Certifications

MPT is MIL-PRF-38534 Class H qualified since 1998, QML-38534 listed, certified by DSCC (Defense Supply Center, Columbus, OH). MPT is AS9100D ISO 9001:2015, and ITAR registered.