Phone: 603.893.7600

ISO-9001:2008 Certified ~ MIL-PRF-38534 Class H Qualified ~ QML-38534 Listed

Wire Bonding

Connecting one conductive surface to another conductive surface via fine gold or aluminum wires.

Two methods of wire bonding:

  1. Ball bond:  round wire (1/1000 in diameter), pressure creates ball at end of wire to connect with surface.  Can connect to smaller area.
  2. Wedge bond: flat wire, wire is laid on surface flattened.  Stronger bond, typically used in higher power applications.

MIL-STD-883 standards define MPT wire bonding. MPT expertise make our wire bonding processes flexible and small-lot friendly. Call to talk to an engineer about your hybrid assembly.

Micro-Precision Technologies, Inc. 10 Manor Parkway, Ste. C, Salem, N.H. 03079
Tel - (603) 893-7600 ~ Fax - (603) 893-9110