Wire Bonding

Connecting one conductive surface to another conductive surface via fine gold or aluminum wires.

MIL-STD-883 standards define MPT wire bonding. MPT expertise make our wire bonding processes flexible and small-lot friendly. Call to talk to an engineer about your hybrid assembly.

Wire Bonding Methods

Ball Bond

Round wire (1/1000 in diameter), pressure creates ball at end of wire to connect with surface. Can connect to smaller area.

Wedge Bond

Flat wire, wire is laid on surface flattened. Stronger bond, typically used in higher power applications.

Die Attachment

Attachment of a die to the surface of a circuit. Typically attached with epoxy and wire-bonded.

MPT expertise makes our die attachment processes flexible and small-lot friendly. All processes comply to MIL-STD-883. Call to talk to an engineer about your hybrid assembly.

Why Micro Precision Technologies

  • Small Lot Friendly
  • Consigned or Full Turnkey Assemblies
  • Class 5000 Cleanroom for Assembly (0.5 micron per cubic foot)
  • Class 100 Cleanroom for Pre-Cap Inspection (0.5 micron per cubic foot)
  • ISO-9001:2008 Certified
  • MIL-PRF-38534 Class H Qualified
  • QML-38534 Listed

Contact Us to talk to an engineer about your hybrid assembly today.