MPT capabilities include manufacturing multi-layer substrates. These substrates consist of screened conductor layers, separated by dielectric layers, which can be connected by vias. Multi-layer capability is one of the advantages of thick film technology. MPT specializes in multi-layer thick film technology.
Dielectric breakdown > 400 DC Volts/mil. MPT can manufacture substrates up to 10 conductor layers.
Talk to our engineers about reducing the footprint of your circuit.
Why Micro Precision Technologies
- Small Lot Friendly
- Consigned or Full Turnkey Assemblies
- Class 5000 Cleanroom for Assembly (0.5 micron per cubic foot)
- Class 100 Cleanroom for Pre-Cap Inspection (0.5 micron per cubic foot)
- ISO-9001:2008 Certified
- MIL-PRF-38534 Class H Qualified
- QML-38534 Listed
Contact Us to talk to an engineer about your hybrid assembly today.