Multi-Layer Substrate/Dielectrics
MPT capabilities include manufacturing multi-layer substrates. These substrates consist of screened conductor layers, separated by dielectric layers, which can be connected by vias. Multi-layer capability is one of the advantages of thick film technology. MPT specializes in multi-layer thick film technology.
Dielectric breakdown > 400 AC Volts/mil. MPT can manufacture substrates up to 10 conductor layers.
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