MPT capabilities include manufacturing multi-layer substrates. These substrates consist of screened conductor layers, separated by dielectric layers, which can be connected by vias. Multi-layer capability is one of the advantages of thick film technology. MPT specializes in multi-layer thick film technology.

Dielectric breakdown > 400 DC Volts/mil. MPT can manufacture substrates up to 10 conductor layers.

Talk to our engineers about reducing the footprint of your circuit.

Why Micro Precision Technologies

  • Small Lot Friendly
  • Consigned or Full Turnkey Assemblies
  • Class 5000 Cleanroom for Assembly (0.5 micron per cubic foot)
  • Class 100 Cleanroom for Pre-Cap Inspection (0.5 micron per cubic foot)
  • ISO-9001:2008 Certified
  • MIL-PRF-38534 Class H Qualified
  • QML-38534 Listed

Contact Us to talk to an engineer about your hybrid assembly today.