Hybrid assembly consists of attaching components onto a screened substrate and sealing the substrate into a package. The hybrid assembly process may include surface mount, die attachment, wire bonding, and packaging. Functional testing is performed both prior to sealing and post sealing into package. Environmental testing is performed post sealing.

MPT is committed to excellent quality, customer service, product and process innovation. MPT provides quick turn-around for prototypes and in-time production. MPT has clean areas of Class 100 for pre-cap inspection and Class 5000 for assembly.

Applications

MPT hybrids have been used in:

  • Signal Conditioning Systems
  • Communications Equipment
  • Radar Equipment
  • Positioning Systems
  • Avionics
  • Navigation Systems
  • Data Conversion
  • Computer Systems
  • Frequency Agile Systems
  • & More

Why Micro Precision Technologies

  • Small Lot Friendly
  • Consigned or Full Turnkey Assemblies
  • Class 5000 Cleanroom for Assembly (0.5 micron per cubic foot)
  • Class 100 Cleanroom for Pre-Cap Inspection (0.5 micron per cubic foot)
  • ISO-9001:2008 Certified
  • MIL-PRF-38534 Class H Qualified
  • QML-38534 Listed

Contact Us to talk to an engineer about your hybrid assembly today.