Material Description Thickness Area Up To
Alumina
(Al2O3)
Most commonly used substrate.
Good thermal conductivity.
Most economical material.
96% to 99.6% 0.010” to 0.080” 4.5" x 4.5"
Aluminum Nitride
(AlN)
Better thermal conductivity than alumina. -- 0.020" to 0.040" 4" x 4"
Beryllium Oxide
(BeO)
Best thermal conductivity.
Conducts heat almost as well as copper.
99% BeO 0.015” to 0.080” 4" x 4"

Why Micro Precision Technologies

  • Small Lot Friendly
  • Consigned or Full Turnkey Assemblies
  • Class 5000 Cleanroom for Assembly (0.5 micron per cubic foot)
  • Class 100 Cleanroom for Pre-Cap Inspection (0.5 micron per cubic foot)
  • ISO-9001:2008 Certified
  • MIL-PRF-38534 Class H Qualified
  • QML-38534 Listed

Contact Us to talk to an engineer about your hybrid assembly today.