Volume Prototypes to Thousands per month
Westbond Auto Ball/Wedge Bonder
- 3x3 wedge bond area
- 4x6 ball bond area
- Cognex pattern recognition, high frequency ultrasonics
- Stud Bumping & Security Ball
Hughes 2460-V Auto Wedge Bonder
- Deep Access - Ultrasonic or Thermosonic wedge bonding
- Bond Area: up to 5 in. x 12 in.
- Gold or Aluminum wire, 0.7 to 2 mil Ribbon Bonds - half X 3 or 5
(2) MRSI 505 Die Attach Systems
- Die sizes from .008 to 1.5 inches
- 12.5 µm placement accuracy
- Programmable bond force/dwell
(10-500 gms) - Epoxy Stamping: .004 mil Dot+
MRSI 170 Dispense System
- Dual Auger pumps with 10x10 dispense area
- Epoxy, under-fill, encapuslate, optical fluid can be dispensed and accurately controlled
Hesse Autobonder, Ai/Au Wedge
- Large 8"x10" bonding area
- Heated stage for Au wedge
- Vision system
- High speed bonding
SST1200 Vacuum Seal Oven
- 5" x 4" process area
- Lid seal
- Eutectric die attach
- 450°C operating temperature
Talk To Our Engineers
- P: 603-893-7600
- E: [email protected]
- Below is our Quick Contact form. To send us a file, use our Quote form instead.
Certifications
MPT is MIL-PRF-38534 Class H qualified since 1998, QML-38534 listed, certified by DSCC (Defense Supply Center, Columbus, OH). MPT is AS9100D ISO 9001:2015, and ITAR registered.