A More Robust Alternative

Thick film hybrids are a more robust alternative to Printed Circuit Boards (PCB). In many cases, a thick film hybrid can replace the PCB to function in environmentally adverse conditions. Thick film hybrids can operate in many harsh environments where traditional PC boards fail, such as extreme heat, high vibration, downhole mining, deep sea wells and space.

Ceramic substrates such as alumina, aluminum nitride, and beryllium oxide are highly thermally conductive materials which transfer heat away from hot spots quickly and efficiently, dissipating it over the whole surface. PCB material (FR-4) is epoxy based with poor thermal conductivity, leading to hot spots which reduce the life of most semiconductor junctions.

Typical thermal conductivities of ceramics and FR-4 are:

Material	(W/m-K)
Alumina	28–35
Aluminum Nitride	140–180
Beryllium Oxide	170–280
FR-4	0.8–1.1