A More Robust Alternative
Thick film hybrids are a more robust alternative to Printed Circuit Boards (PCB). In many cases, a thick film hybrid can replace the PCB to function in environmentally adverse conditions. Thick film hybrids can operate in many harsh environments where traditional PC boards fail, such as extreme heat, high vibration, downhole mining, deep sea wells and space.
Inherent Thermal Management
Ceramic substrates such as alumina, aluminum nitride, and beryllium oxide are highly thermally conductive materials which transfer heat away from hot spots quickly and efficiently, dissipating it over the whole surface. PCB material (FR-4) is epoxy based with poor thermal conductivity, leading to hot spots which reduce the life of most semiconductor junctions.
Typical thermal conductivities of ceramics and FR-4 are:
| Material | (W/m-K) |
|---|---|
| Alumina | 28–35 |
| Aluminum Nitride | 140–180 |
| Beryllium Oxide | 170–280 |
| FR-4 | 0.8–1.1 |
Solutions
Thick Film
Circuitry screened onto ceramic substrates are a robust, compact & economical option for higher thermal efficiency. Ceramic substrates can be screened in conductor layers, separated by dielectric layers, and connected by vias.
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FR4 Conversions
Conversion of single-board computer assembly on FR-4 to MPT ceramic engineered substrate for your product/designs that require more efficient thermal management.
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Hybrid Assembly
MPT hybrid assembly capabilities include manual and automated surface-mount technology (SMT), wire-bonding and die attach. Assembled in class 10,000 clean room.
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Die Attach & Wire Bonding
MPT has both manual and automated wire-bonding and die-attach capabilities. These include ball and wedge bonding, auto die attach and auto dispense for epoxy, encapsulate or optical fluid.
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Semiconductor Packaging
We can repackage a standard or customized die into a different package which may improve the thermal performance, pinout configuration, electrical performance, or mechanical size and shape.
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Component Testing
Our extensive test program library offers capabilities for AC, DC parametric and functional evaluation and testing of a wide array of devices, ranging from diodes and transistors to more complex technologies.
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MPT is MIL-PRF-38534 Class H qualified since 1998, QML-38534 listed, certified by DSCC (Defense Supply Center, Columbus, OH). MPT is AS9100D ISO 9001:2015, and ITAR registered.